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Sensitive detection of polyimides degradation by microorganisms using electrochemical impedance spectrosopy

机译:使用电化学阻抗光谱法灵敏检测微生物降解微生物

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摘要

The microbial degradation of electronic insulation polyimides was monitored and evaluated using electro-chemical impedance spectroscopy (EIS). The microbial inoculum, comprising Aspergillus versicolor, Chaetomium species, Cladosporium cladosporioides, and Tricoderma viride, was isolated previously from deteriorated polyimides. After inoculation, fungal growth on the polyimides resulted in distinctive EIS spectra indicative of polymer insulation failure, which directly related to polymer integrity. Degradation appeared to progress in a number of steps and two distinctive stages in the decline of film resistance were detected in the EIS cells within 24 and 72 days after inoculation. The early stage of the decrease in resistance may be related to the ingress of water molecules and ionic species into the polymeric materials, while the second stage probably resulted from partial degradation of the polymers by fungal growth on the polymer film. The relationship between changes of impedance spectra and microbial degradation of the polymer was further supported by scanning electron microscopy (SEM) of fungi growing on the surface of the inoculated polyimides. Our data indicate that the EIS technique can be used to detect the early degradation of resistant polymers and that polyimides are susceptible to biodegradation by fungi.
机译:使用电化学阻抗谱(EIS)监测和评估电子绝缘聚酰亚胺的微生物降解。预先从退化的聚酰亚胺中分离出包括杂色曲霉,Chaetomium种类,Cladosporium cladosporioides和Tricoderma viride的微生物接种物。接种后,在聚酰亚胺上的真菌生长导致表明聚合物绝缘失效的独特EIS光谱,这直接与聚合物完整性有关。接种后24和72天内,在EIS细胞中,降解似乎以许多步骤进行,并且在膜电阻下降的两个不同阶段被检测到。电阻降低的早期阶段可能与水分子和离子物质进入聚合物材料有关,而第二阶段可能是由于真菌在聚合物膜上生长引起的部分降解而导致的。阻抗谱的变化与聚合物的微生物降解之间的关系进一步得到了在接种的聚酰亚胺表面上生长的真菌的扫描电子显微镜(SEM)的支持。我们的数据表明,EIS技术可用于检测抗性聚合物的早期降解,并且聚酰亚胺易于被真菌生物降解。

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